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Jonathan E. Grindlay
Jonathan E. Grindlay
Smithsonian Institution
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Application-specific integrated circuit
Wire bonding
Integrated circuit
Globular cluster
3
Papers
7
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TSV-Last Integration to Replace ASIC Wire Bonds in the Assembly of X-Ray Detector Arrays
2021
ECTC | Electronic Components and Technology Conference
Jennifer Ovental Hicks
Dean Malta
David Bordelon
Daniel Richter
Jaesub Hong
Jonathan E. Grindlay
Branden E. Allen
Daniel P. Violette
Hiromasa Miyasaka
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Proof of concept for through silicon vias in application-specific integrated circuits for hard x-ray imaging detectors
2021
Journal of Astronomical Telescopes, Instruments, and Systems
Jaesub Hong
Jonathan E. Grindlay
Branden Allen
Daniel P. Violette
Hiromasa Miyasaka
Dean Malta
Jennifer Ovental
David Bordelon
Daniel Richter
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Globular Cluster X-ray Sources
1977
Highlights of Astronomy
Jonathan E. Grindlay
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Citations (7)
1