Copper plating

Copper plating is the process of plating a layer of copper electrolytically on the surface of an item. It takes place in an electrolytic cell where electrolysis which uses direct electric current to dissolve a copper rod and transport the copper ions to the item. Into a container of water are placed a copper rod, and the item. The water contains an ionic solution which allows a direct electric current to flow from the copper rod to the item. The copper rod is the anode and the item is the cathode. This current flow causes the copper to ionize, become oxidized which means each atom becomes positively charged by losing an electron. As the copper ions dissolve into the water, they form a coordination complex with salts already present. The copper then physically flows to the item, where it is reduced to the metallic state by gaining electrons. This forms a thin, solid, metallic copper film on the surface of the item. Copper plating is the process of plating a layer of copper electrolytically on the surface of an item. It takes place in an electrolytic cell where electrolysis which uses direct electric current to dissolve a copper rod and transport the copper ions to the item. Into a container of water are placed a copper rod, and the item. The water contains an ionic solution which allows a direct electric current to flow from the copper rod to the item. The copper rod is the anode and the item is the cathode. This current flow causes the copper to ionize, become oxidized which means each atom becomes positively charged by losing an electron. As the copper ions dissolve into the water, they form a coordination complex with salts already present. The copper then physically flows to the item, where it is reduced to the metallic state by gaining electrons. This forms a thin, solid, metallic copper film on the surface of the item. There are three primary chemicals used as the complexing agents.: either cyanide, or sulfuric acid, or pyrophosphate. In addition fluoroborate, and proprietary mixtures are used.