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Solder joint reliability study for plastic ball grid array packages
Solder joint reliability study for plastic ball grid array packages
1998
L.-Y. Yang
Y.C. Mui
Keywords:
Intermetallic
Soldering
Ball grid array
Electronic packaging
Circuit design
Finite element method
Integrated circuit
Materials science
Electronic engineering
Integrated circuit packaging
reliability study
Chip
Mechanical engineering
Correction
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