Old Web
English
Sign In
Acemap
>
Paper
>
Effect of Intermetallic Compound and Kirkendall Void Growth on Mechanical Reliability of Cu Pillar Bump
Effect of Intermetallic Compound and Kirkendall Void Growth on Mechanical Reliability of Cu Pillar Bump
2008
Gi-Tae Im
Byeong-Jun Kim
Gi-Uk Lee
Min-Jae Lee
Yeong-Chang Ju
Yeong Bae Park
Keywords:
void
Pillar
Composite material
Intermetallic
Kirkendall effect
mechanical reliability
Materials science
Correction
Source
Cite
Save
Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI
[]