A method of manufacturing a bonding material, manufacturing method of the adhesive patterned substrate and the adhesive patterned substrate

Production method of the adhesive of the present invention includes a first adherend and the second adherend is a method for producing a bond substance is bonded via an adhesive pattern, a first adherend a step of providing an adhesive layer thereon, the state to the surface contacting with the first adherend of the adhesive layer a protective layer for protecting a predetermined portion of the adhesive layer from the etching on the opposite surface is provided in comprising a step of forming an adhesive pattern by etching the adhesive layer, and a step of bonding a second adherend to the adhesive pattern after the protective layer has been removed.