Novel rapid‐cure adhesives for low temperature using thiirane compound

We investigated improvement of workability (viscosity), storage stability, and curing ability of thiirane resin for adhesive applications. The viscosity of bisphenol-F thiirane resin was lower than that of bisphenol-A thiirane resin, especially at low temperatures, thus improving ease of handling. Addition of diphenyl decyl phosphite improved its storage stability to a level similar to that of bisphenol-A epoxy resin. The curing of bisphenol-F thiirane resin increased three times faster by adding 2,4,6-tris(dimethylaminomethyl)phenol (DMP-30) as a tertiary amine. In applications of this new thiirane resin as civil and architectural adhesives, a superior curing ability at low temperature was attained. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 82: 2953–2957, 2001