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Study of Adhesion Properties of Cu on Photosensitive Insulation Film for Next Generation Packaging
Study of Adhesion Properties of Cu on Photosensitive Insulation Film for Next Generation Packaging
2015
Kenichi Iwashita
Tetsuya Katoh
Akihiro Nakamura
Yasuharu Murakami
Tomio Iwasaki
Yuka Sugimasa
Jun Nunoshige
Hiroshi Nakano
Keywords:
Sputtering
Materials science
Adhesion
Composite material
Molecular dynamics
Correction
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