Corrosion of gold bridgewire in electronic components

Accelerated aging tests on gold bridgewired detonator assemblies to determine compatibility of the Au and Pd-In-Sn solder with the organic explosive, PENT, have revealed an unusual corrosion process. These tests, conducted at 74/sup 0/C and 54/sup 0/C indicated a preferential attack of the gold. A matrix of corrosion test units was established to study this corrosion problem with accelerating temperatures up to 100/sup 0/C. Scanning electron microscopy (SEM), energy dispersive x-ray (EDX), and x-ray diffraction techniques were used to determine the extent of the corrosion and identify the corrosion products. Results indicate the preferential attack of the gold was due to HCN formed by decomposition of the explosive powder (PETN) at high temperatures. Other associated reactions were also observed including subsequent attack of the solder by the gold corrosion product and degradation of the plastic header.