Opportunities and challenges in ultra low k dielectrics for interconnect applications

Sampath Purushothaman,Satya V. Nitta,James Gardner Ryan,Chandrasekhar Narayan,Mahadevaiyer Krishnan,S. Cohen,Stephen M. Gates,Stanley Joseph Whitehair,Jeffrey C. Hedrick,Christy S. Tyberg,Stephen E. Greco,Kenneth P. Rodbell,Elbert E. Huang,Timothy J. Dalton,Ronald A. DellaGuardia,Katherine L. Saenger,Eva E. Simonyi,S. T. Chen,Kelly Malone,Robert D. Miller,Willi Volksen

Opportunities and challenges in ultra low k dielectrics for interconnect applications

2001

In this paper, we discuss the challenges associated with producing, characterizing and integrating porous dielectrics into back-end-of-line (BEOL) interconnects and present results from our integration evaluations.

Keywords:

Optoelectronics
Permittivity
Dielectric
Back end of line
Porous medium
Physics
Electronic engineering
Porosity
Interconnection
dielectric thin films

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