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Thin-film reactions during diffusion soldering of Cu/Ti/Si and Au/Cu/Al 2 O 3 wit
Thin-film reactions during diffusion soldering of Cu/Ti/Si and Au/Cu/Al 2 O 3 wit
2003
Liang Ma
Tung-Ling Hsieh
S. Y. Chang
Trees-Juen Chuang
Keywords:
Thin film
Metallurgy
Soldering
Bond strength
Chemistry
Intermetallic
Activation energy
Double layer (surface science)
Ultimate tensile strength
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