Measurability analysis of the HAR structure in 3D memory by T-SAXS simulation

To control the HAR (High Aspect Ratio) processes for producing 3D memories, a non-destructive and highly accurate measurement method is required. We report simulation results of T-SAXS (Transmission Small Angle X-ray Scattering) measurability analysis to evaluate its measurement capability of profile parameters for typical HAR structures. After that, we discuss T-SAXS extensibility for profile measurements of future 3D memories, based on measurability analysis for various HAR structural models by varying their structural parameters. For the deep depth region which is important for the future 3D memory shape measurement, we confirmed that the HAR structure with its depth = 30 μm can be measured under the assumed criteria of precision < 1%.