Light emitting diode (LED) and production method thereof

It is an object of the present invention to provide an LED and a manufacturing method thereof, where a temperature rise resulting from the heat emission can be suppressed in an excellent manner, where the production of a multi-chip LED is easily possible and are configured in a simple and compact manner can and further can be installed without the use of connecting or bonding wire easy. Means to Solve the Problems A LED 10 is provided, comprising: a silicon substrate 11; a pair of electrodes 14, 15 which are formed within a hopper which is formed on the silicon substrate by anisotropic etching; an LED chip 12 mounted within the hopper, wherein the LED chip is electrically connected to the pair of electrodes; and a resin mold 13 that is made of a resin material that is filled into the funnel.