Low Resistivity Junction between YBa2Cu3O7-x Superconductor and Metals by Evaporation Method
1991
Electrical properties of an YBa2Cu3O7-x/metal film/indium interface were examined by the DC four-probe technique. Contact resistance in the order of 10-6Ω·cm2 was achieved with gold, silver and copper, while a high-resistive and non-ohmic junction was formed with indium. Evaporation of Ib metals was very effective in decreasing the contact resistance and such a technique will be of experimental or practical use in large current carrying applieations of YBa2Cu3O7-x.
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