chip bonding process on a substrate strain and stress under method of operating a semiconductor readout circuit

The invention relates to a collective method for bonding the individual chips on a constraint of the substrate (44), which comprises the following steps: - available functionalized layers (40) on a support (41) of non-contiguous adjacent, with a spacing e between two layers (40) neighboring, - depositing a drop of calibrated adhesive (43) on each of the functionalized layers - one defers the constraint substrate (44) on the glue drops, - one singles parts the assembly thus formed to produce chips (45) glued to the surface of the substrate contrainte.L'invention also relates to a constraint in setting method of a semiconductor readout circuit with a substrate in a coefficient of expansion material different.