Développement d'un procédé de dopage de matériaux semi-conducteurs par plasma : caractérisation du plasma et de son interaction avec les matériaux

The aim of this work is to characterize the boron trifluoride plasma and its interaction with the materials during the ultra-shallow-junction doping process for semiconductors using a pulsed plasma doping system (PLAD). In order to measure in situ the ion energy distribution of the various ions present in the plasma, accelerated by the negative pulse and implanted into the silicon wafer, a special cathode was designed with a mass spectrometer installed in its center. The measurement of the composition of the bulk plasma ions as well as the composition of the ions provides some information on the collision processes that occur inside the sheath. Thanks to a better understanding of these processes, the doping process can be optimized. Based on the ion energy distributions measured with the mass spectrometer, the dopant depth profile can be predicted and the plasma can be tuned in order to obtain shallower dopant depth distribution in the silicon after plasma doping implantation.