Effect of electrodeposition conditions on the properties of Cu–Si3N4 composite coatings

Abstract Cu–Si 3 N 4 composite coatings were obtained by co-electrodeposition under DC conditions from a copper sulphate bath containing suspended Si 3 N 4 particles. The effect of some electroplating parameters such as surfactant (SDS) concentration, stirring rate, and particle concentration on microstructural and mechanical properties of the coatings was investigated. The incorporation of Si 3 N 4 particles into the copper matrix resulted in the production of coatings with finer copper grains. The incorporation of Si 3 N 4 particles also led to a change of the preferred growth orientation of copper grains from (2 0 0) to (2 2 0) crystal face. Cu–Si 3 N 4 composite coatings presented lower friction coefficient and wear loss than pure copper deposit due to the increased hardness related to grain refinement strengthening and dispersion strengthening.