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Study on Characteristic of Material Removal Rate in Chemical Mechanical Polishing of Silicon Wafer
Study on Characteristic of Material Removal Rate in Chemical Mechanical Polishing of Silicon Wafer
2008
Jianxiu Su
Xiqu Chen
Xueliang Zhang
Jiaxi Du
Dongming Guo
Keywords:
Wafer
Mathematics
Chemical-mechanical planarization
Metallurgy
material removal
Correction
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