A New Plasma Resistant Coating Reducing Particle Generations

Aerosol Deposition Method (ADM) is a new technology of ceramics film deposition. Using this method, we can deposit various ceramics thick films (one-several hundreds micrometer of thickness) on metal, glass and ceramics substrates. It's normal temperature process and doesn't require any heating expedient. Films have dense nano-crystalline structure, good adhesion on many substrate and good mechanical properties. For several years we have been developing this process. In this paper, overview of application to semiconductor manufacturing equipment parts by ADM was reported.