Sensor module and manufacturing method of a sensor module
2009
A sensor module comprises a chip carrier and a sensor chip arranged thereon. The sensor module has on a second side of the chip carrier at least a partial cover with a recess, so that heat can be dissipated from the chip carrier and / or sensor chip to the recess. Furthermore, a manufacturing method of a covered sensor module is described, wherein the cover has a recess.
- Correction
- Source
- Cite
- Save
- Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI