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Design, Fabrication and Bumping of Test Chips for Development of Fine Pitch Flip-Chip Technologies.
Design, Fabrication and Bumping of Test Chips for Development of Fine Pitch Flip-Chip Technologies.
1999
Jan Vanfleteren
Johan De Baets
André Van Calster
G. Schols
N Pergoot
E. Jarvinen
A. Aintila
Keywords:
Fabrication
Flip chip
Manufacturing engineering
Materials science
Bumping
Electrical engineering
fine pitch
Mechanical engineering
Computer science
Correction
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