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Failure prediction of the solder joints in the ball-grid-array package under thermal loading
Failure prediction of the solder joints in the ball-grid-array package under thermal loading
2019
A.F.M. Yamin
A.S. Abdullah
M F A Manap
H. Yusoff
Keywords:
Mechanical engineering
Ball grid array
Soldering
Thermal
Materials science
Correction
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