High density packaging for mobile terminals

Personal electronics devices are miniaturized to be more comfortable to carry, this size reduction desire, together with increased functionality, have become drivers, especially for wireless devices. Mobile terminal electronics have set a challenge for packaging and provided the motivation to verify emerging technologies. Chip Scale Packages (CSP), flip-chip and passive integration technologies have been verified by building two technology verifiers, both GSM mobile terminals based on the electronics of existing products. High Density PWB (HDPWB) technologies were selected to provide the required routing density for flip-chip assembly. These electronics modules were assembled into the mechanics of existing mobile terminals, facilitating full electrical characterization.