Research development of compound Cu6Sn5 between Sn-based lead-free solders and Cu substrate

The relation of reliability of soldering joints and the intermetallic compound(IMC) Cu6Sn5 resulted from the interfacial reaction between Sn-based lead-free solders and Cu substrates is introduced.The research developments about Cu6Sn5 in this years are reviewed,whose contents include the growth morphology,crystal orientation,growth kinetics and the effect of nano-particles on the size and morphology of Cu6Sn5 phase formed between Sn-based solders and Cu substrates.