Thermal Properties of the Graphene Oxide (GO) Reinforced Epoxy Composites (Thermal Adhesive Liquid Type): Application of Thermal Interface Materials

Epoxy mixed with others filler for thermal interface material (TIM) has been well researched. There are some issues occurs when epoxy is used as matrix material likes non-uniform thickness of thermal interface material produce, time taken for solidification and others. New high-performance phase change material (PCM) using graphene as main material to overcome the existing problem and at the same time to increase thermal conductivity. Three types of composite graphene were used for thermal interface material in this research. The sample that contain 10, 20 and 30 wt. % of graphene was used with different contain of graphene oxide (GO). The thermal conductivity of thermal interface material is both measured and it was found that the increase of amount of graphene used will increase the thermal conductivity of thermal interface material. The highest thermal conductivity is 12.8 W/(mK) with 30 w.% graphene. The comparison between the present thermal interface material and other thermal interface material show that this present graphene composite is a commendable thermal interface material in increasing thermal conductivity and reducing thermal contact resistance.