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Reduction of Thermal Stress in Copper TSV due to Annealing by Low TEC Copper
Reduction of Thermal Stress in Copper TSV due to Annealing by Low TEC Copper
2018
V Quy Dinh
Kazuo Kondo
Tetsuji Hirato
Keywords:
Copper
Annealing (metallurgy)
Metallurgy
Stress (mechanics)
TEC
Materials science
Correction
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