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Centrifugal Formulation of Percolating Thermal Underfills for Flip-Chip Applications
Centrifugal Formulation of Percolating Thermal Underfills for Flip-Chip Applications
2012
Zuercher
Goicochea
Matsumoto
michel
Brunschwiler
Keywords:
Materials science
Flip chip
Mechanical engineering
Thermal
Correction
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