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PWB Using Mechanically Pre-drilled Metal Clad Film for IVH and Build-up PWB with Laser Via Hole for Semiconductor Package Substrate
PWB Using Mechanically Pre-drilled Metal Clad Film for IVH and Build-up PWB with Laser Via Hole for Semiconductor Package Substrate
1998
Shigeharu Arike
Kazuhisa Otsuka
Naoyuki Urasaki
Akishi Nakaso
Katsuji Shibata
Kazuhito Kobayashi
Kouichi Tsuyama
Kuniji Suzuki
Hajime Nakayama
Keywords:
Materials science
Semiconductor package
Metal
Laser
Optoelectronics
Substrate (chemistry)
Correction
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