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Ultrafine ductile-mode dicing technology for SiC substrate with metal film using PCD blade
Ultrafine ductile-mode dicing technology for SiC substrate with metal film using PCD blade
2019
Takashi Fujita
Yasuo Izumi
Junji Watanabe
Keywords:
Engineering
Substrate (chemistry)
Control engineering
Ductility
Metal
Composite material
Wafer dicing
sic substrate
Correction
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