A multi-parameter numerical modeling and simulation of the dipping process in microelectronics packaging

In order to simulate the flux dipping process of microbump flip chip bonding, multiparameter experiments are designed. The dipping process of microbumps is captured by the high-speed camera, so that we can obtain the quantitative relationship between the dipping quantity and its viscosity, dipping speed, dipping depth, and dipping time by virtue of image processing. Furthermore, corresponding mathematical models are established by curve fitting. Finally, all of the numerical models are integrated; numerical simulation is carried out by MATLAB-Simulink and graphical user interface; and a new simulation software is developed, thus providing an important basis and guidance for flux dipping application and parameter selection.