Release the polyimide film, the adhesive layer with the release polyimide film with laminate, laminate, method for producing the adhesive layer with the release polyimide film with a single layer or a multilayer wiring board and a multilayer wiring board

Is unnecessary etching after the hot pressing step, the insulating layer of a suitable surface roughness semi-additive method is obtained, release the polyimide film as a further flatness of good single layer or a material capable of producing a multilayer wiring board I will provide a. More specifically, on at least one surface of the polyimide film, to provide release polyimide film having a release layer comprising a alkyd resin and amino resin. Further, the release polyimide film having an adhesive layer on the release layer on the surface not provided with the polyimide film, by laminating a single layer or a multilayer wiring board, the adhesive layer with the release polyimide film with a single layer or process for manufacturing a multilayer wiring board, the step of removing the release polyimide film from the adhesive layer with the release polyimide film with a single layer or a multilayer wiring board, and a step of circuit processing, to provide a method of manufacturing a multilayer wiring board.