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Current Induced Grain Growth of Electroplated Copper Film (Special Issue : Advanced Metallization for ULSI Applications)
Current Induced Grain Growth of Electroplated Copper Film (Special Issue : Advanced Metallization for ULSI Applications)
2012
Liyana Razak
Takamasa Yamaguchi
Seishi Akahori
Keywords:
Materials science
Copper
Electroplating
Grain growth
Metallurgy
Correction
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