Old Web
English
Sign In
Acemap
>
Paper
>
Development of Ultra Low CTE (Coefficient of Thermal Expansion) Substrate Materials for Semiconductor Package
Development of Ultra Low CTE (Coefficient of Thermal Expansion) Substrate Materials for Semiconductor Package
2016
Shin Takanezawa
Hikari Murai
Masato Miyatake
Tomohiko Kotake
Shintaro Hashimoto
Shin-ichiro Abe
Masaaki Takekoshi
Masahisa Ose
Koji Morita
Tomio Iwasaki
Keywords:
Composite material
Electronic engineering
Materials science
Thermal expansion
Substrate (chemistry)
Semiconductor package
Correction
Source
Cite
Save
Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI
[]