Professional development courses for the 65th ECTC

Summary form only given. Paper covers the following topics: lead-free solder joints; fan-out wafer level packaging; package failure analysis; ultra-small smart mobile; wearable systems; medical systems; IoT systems; polymers; nanocomposites; electronic packaging; photonic packaging; integrated thermal packaging; power electronics reliability; electronic packaging; interposers; flip chip technologies; wafer level chip scale packaging; microelectronic package reliability; IC package yield; package failure mechanisms; 3D IC integration; and 3D IC packaging.