Interfacial reactions in the Sn-Sb/Ag and Sn-Sb/Cu couples

Abstract Sn–Sb and Sn–Sb-based alloys are important high temperature solders. Interfacial reactions are examined in the Sn-5.0 at% Sb/Ag and Sn-10.0 at% Sb/Ag at 200 °C, and Sn-5.0 at% Sb/Cu and Sn-10.0 at% Sb/Cu at 250 °C. Only the Ag 3 Sn phase is formed in the Sn–Sb/Ag couples, and Cu 6 Sn 5 and Cu 3 Sn phases are formed in the Sn–Sb/Cu couples. The reaction products all grow linearly with the square root of reaction time which suggests the interfacial reactions are diffusion controlled.