A Structural Genomics Approach to the Study of Quorum Sensing

A controller controls cutting of simultaneously cutting wafers by performing electrical discharge machining while moving a workpiece relative to cutting wire sections in a direction at right angles to the cutting wire sections in a plane perpendicular to the axial direction of main guide rollers and leaving a connection at which a part of each wafer that has been incompletely cut is still connected to the workpiece, and shape correction of causing the cutting wire sections to perform scanning while performing electrical discharge machining along a path of the cutting wire sections in a cutting direction at the time of the cutting to simultaneously correct the shape of a plurality of cut surfaces that are cut at the time of the cutting.