Carrier for an optoelectronic component, method for producing a support for an optoelectronic component, wafers and soldering

The invention relates to a carrier for an optoelectronic device, comprising: - a base body, - wherein the base body comprises a first electrically conductive Heizschichtanordnung, - wherein a first layer of solder for soldering an optoelectronic component is arranged at the base body on a first side of the base body, - wherein the first electrically conductive Heizschichtanordnung from the first solder layer electrically insulated from and thermally connected to the first solder layer. The invention further relates to a method for producing a support for an optoelectronic device. The invention further relates to a wafer and a soldering method.