The thermal behavior of dithiooxamide ligands and their nickel complexes

Abstract The thermal behavior of substituted dithiooxamide ligands and their nickel complexes has been studied with differential scanning calorimetry and thermogravimetry. The thermal products were analyzed by mass spectral and IR techniques. The mechanism of the thermal decomposition of both the free ligands and metal complexes precludes the clean thermal formation of the polymeric nickel complexes from the neutral ligand derivatives, Ni(LH 2 ) 2 Br 2 .