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Study of growth kinetics of intermetallic phases in Cu-Sn solder joints under the conditions of reactive diffusion
Study of growth kinetics of intermetallic phases in Cu-Sn solder joints under the conditions of reactive diffusion
2021
Jaromír Drápala
Gabriela Kostiuková
Hana Francová
Monika Losertová
Petr Kubíček
Keywords:
Materials science
Composite material
growth kinetics
Diffusion
Soldering
Intermetallic
Correction
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