Method and device reactor for producing thin layers by implementing a series of steps of storages, and applications of this method

Deposition process comprising a sequential implementation of at least two types of deposition from an ALD type of deposition, and a pulsed CVD deposition, and CVD deposition. Each deposit may possibly be plasma enhanced. The different deposits are preferably made in the same room, for implementing different types of deposit. deposition sequences are performed so as to obtain the characteristics of particular layers, such as for example a predetermined value of compliance, a bonding layer of special quality or a particular quality barrier layer. Application in particular to carry out interconnection holes (vias)