Old Web
English
Sign In
Acemap
>
Paper
>
Evaluating underfill material for 3D integration of high density heterogeneous sensor arrays
Evaluating underfill material for 3D integration of high density heterogeneous sensor arrays
2014
Christopher Gregory
Matthew Lueck
John Lannon
Alan Huffman
Dean Malta
Dorota Temple
Keywords:
Flip chip
high density
Composite material
Materials science
Correction
Cite
Save
Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI
[]