Apparatus for plasma-assisted chemical surface treatment of substrates in vacuo

The invention relates to an apparatus for plasma-assisted chemical surface modification of substrates in vacuo. In this case, at least one layer on a surface of substrates but also formed a removal of such a surface are made. It is an object of the invention to provide a way to achieve favorable electrical conditions in the modification of substrate surfaces in a vacuum by an improved electrical current flow. In the inventive apparatus a substrate formed from an electrically conductive material substrate support and at least a portion of an electrode unit are disposed within a vacuum chamber. The electrode unit is parallel to the surface to be modified of the Subtrates aligned and electrically conductively connected to a HF / VHF power source. Furthermore, a reaction gas for forming plasma and the surface modification is to be introduced in a unit which is arranged between electrodes and substrate plasma reaction space above the electrode unit. The plasma reaction chamber is surrounded by an electrical shield at its radially outer edge connected to ground potential and is electrically conductively connected to the electrode unit with the HF / VHF power source. In addition, a contact frame is provided, which is electrically conductively connected to the shield. The contact frame can thereby be moved. By moving the ...