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Electrochemical Behavior and Analysis of Organic Additives in Sub 14nm Copper Damascene Plating Baths
Electrochemical Behavior and Analysis of Organic Additives in Sub 14nm Copper Damascene Plating Baths
2017
Michael Pavlov
Danni Lin
Eugene Shalyt
Isaak Tsimberg
Keywords:
Copper
Electrochemistry
Copper interconnect
Metallurgy
Chemistry
copper damascene
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