The Study of large Area and low Temperature die Bonding

The critical concerns of heat radiation for Light Emitting Diode (LED) includes the LED material and the following packaging material and process. From the view point of LED structure, the heat resistance of the die attachment layer is the dominant actor of the heat radiation for LED. A well bonding die attachment layer benefits the heat radiation of LED. The ITRI-Bond was utilized in this paper, and has a well effect in die bonding of the large LED and Cu plate. Therefore, this paper develop an instrument for die attachment under local vacuum condition. The required properties of this instrument include vacuuming the chamber within 5sec and the bonding void of LED less than 3%.