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E22 Study on Cleaving Mechanism of Silicon Wafer by Laser Beam Irradiation(Laser processing)
E22 Study on Cleaving Mechanism of Silicon Wafer by Laser Beam Irradiation(Laser processing)
2009
Reiko Takeda
Takashi Ueda
Tatsuaki Furumoto
Akira Hosokawa
Ryutaro Tanaka
Keywords:
Cleavage (crystal)
Optoelectronics
Fracture mechanics
Vertical-cavity surface-emitting laser
Wafer
Laser
Crystallography
Beam (structure)
Irradiation laser
Materials science
laser beams
crystal orientation
Correction
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