Development and Evaluation of Carrier Glass Substrate for Fan-Out WLP/PLP Process

The effect of glass type used as fan-out carrier substrate on the reliability of the electrical devices were investigated. Glasses with thermal expansion coefficient of around 6~8 ppm/K with and without alkali ions involved in the glass were tested. With using non-alkali type glass as the carrier material, it was confirmed that the lifetime of the test vehicles were longer than that heated with conventional soda-lime silicate glass by the evaluation under highly accelerated steam and temperature condition.