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Advances in 3D Interconnect Characterization Techniques for Fault Isolation and Defect Imaging
Advances in 3D Interconnect Characterization Techniques for Fault Isolation and Defect Imaging
2016
Wenbing Yun
Mario Pacheco
Sebastian Brand
Peter Czurratis
Matthias Petzold
Tatjana Djuric
Peter Hoffrogge
Mayue Xie
Deepak Goyal
Zhiyong Wang
Antonio Orozco
F. C. Wellstood
Rajen Dias
Keywords:
Electronic engineering
Fault detection and isolation
Materials science
Interconnection
Correction
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