A frequency enhanced single package multi-die memory system using an in-package flyby configuration
2014
We presented an advanced, highly integrated multi-die memory module design of flyby connections, using face-down wire bond assembly technology for DDRx and LPDDR3 operations up to 2400 MT/s. Focusing on LPDDR3 memory, we analyzed the performance impact in different C/A bus topologies and package layouts.
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