Low-temperature-deposited insulating films of silicon nitride by reactive sputtering and plasma-enhanced CVD: Comparison of characteristics

The characteristics of SiN x films deposited by reactive sputtering and plasma-enhanced chemical vapor deposition (PECVD) are examined to obtain high-density films at low deposition temperatures. PECVD SiN x films deposited at 200 °C show low densities of 2.14–2.20 g/cm3 regardless of their composition, while their refractive index varies depending on their composition. PECVD requires the substrate temperature to obtain high-density films, because a possible cause of low-density films is the amount of Si–H bond, rather than that of N–H bond, in the films originating from hydrogen incorporated by the insufficient decomposition of SiH4 molecules at low temperatures. The sputtered SiN x films with high density are obtained at a temperature lower than 200 °C and considered a promising candidate for insulating films at low process temperatures.