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Encapsulation of power electronics components for operation in harsh environments
Encapsulation of power electronics components for operation in harsh environments
2017
Mariusz Stosur
Kacper Sowa
Wojciech Piasecki
Robert Platek
Przemyslaw Balcerek
Keywords:
Computer engineering
Electronic engineering
Engineering
Encapsulation (computer programming)
Power electronics
high pressure
Epoxy
Electronic component
Automotive engineering
Correction
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