Composite-copper, low-thermal-resistance heat sinks for laser-diode bars, mini-bars and single-emitter devices
2008
Here we present characteristic performance of laser-diode devices employing a novel CTE-matched heatsink technology
(where CTE is Coefficient of Thermal Expansion). Design variants of the composite-copper platforms include form-fit-compatible
versions of production CS (for standard 1-cm-wide bars) and CT (for single-emitter devices and mini-bars)
assemblies. Both employ single-step AuSn bonding and offer superior thermal performance to that of current production
standards. These attributes are critical to reliability at high powers in both CW and hard-pulse (e.g., 1sec on/1sec off)
operation.
The superior thermal performance of the composite-copper CS device has been verified in CW testing of bars where
85W is typically obtained at 95A (compared to 76W from production-standard, indium-bonded, solid-copper CS
devices). This result is especially significant as alternative CTE-matched bar platforms (e.g., those employing a sub-mount
bonded to a solid copper heatsink) typically compromise the effective thermal resistance in order to achieve the
CTE match (and often require two-step bonding). The close CTE match of the composite-copper CS results in relatively
narrow, single-peaked spectra. Initial step stress tests of eight devices in hard-pulse operation up to 80A has been
completed with no observed failures. Six of these devices have subsequently been operated in hard-pulse mode at 55A
for >4000 with no failures.
The CT variant of the composite-copper heatsink is predicted to offer a reduction in thermal resistance of nearly 30% for
a 5-emitter mini-bar (500-μm pitch). In first-article testing, the maximum achievable CW power increased from 20W
(standard CuW CT) to 24W (composite-copper CT). As with the CS devices, the composite-copper CT assemblies
exhibited characteristically narrower spectral profiles.
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